Platings > by Property

Search Plating and Finishing by Property

Mitsuya has been providing various metal platings & finishings, by our advanced engineering solution on the industrial plating and finishing functional properties. Our platings & finishings are listed by the property, shown as the bellows. We will continue to update and list our latest platings.

Low Contact Resistant platings

Bright Gold plating (metallization) (containing Cobalt)
Bright Silver plating (metallization)
Direct Gold plating on SUS without Ni under plating
Direct Silver plating on SUS without Ni under plating
Direct Tin plating on SUS without Ni under plating
Discoloration resistant silver plating (MC-11NT-A, B, C)
Electro Nickel-Phosphorus plating
Electroless Gold plating (immersing type for thin deposit)
Electroless Gold plating (reduction type for thick deposit)
Electroless Nickel plating (containing Phosphorus)
Electroless Silver plating
Gold Iron alloy plating (Cobalt and Nickel free)
Gold plating on the inner side of a fine pipe
Gold-Tin alloy plating
Hard Gold plating
Hard Silver plating
High reflective Gold plating
High-technology Three Partial plating
Low phosphorus electroless Nickel plating
Matte Gold plating
Matte Silver plating
Porous Nickel plating
Pure Gold plating
Reel-to-Reel Gold and Tin plating
Reel-to-Reel Gold and Tin-Copper alloy plating
Reel-to-Reel Gold plating
Reel-to-Reel Silver plating
Rhodium plating
Silver-Tin alloy plating
Super soldering Gold plating

Corrosion Resistant platings

Anti-corrosion treatment for aluminum (RoHS compliant)
Black Trivalent Chromate Zinc plating (metallization)
Bright Nickel plating (metallization)
Bright Tin plating (metallization)
Cobalt-Nickel alloy plating (metallization)
Colored trivalent chromate Zinc plating (metallization)
Electroless Nickel Boron Tungsten Plating
Electroless Nickel plating/metallization (containing Boron)
Matte Nickel plating
Matte Tin plating
Nickel Iron alloy plating
Nickel plating for wire bonding
Plating on Powder Particles
Powder Cu copper plating (Metallization)
Powder Ni Nickel Plating (Metallization)
Reel to Reel Tin-Copper alloy solder plating
Reel-to-Reel Nickel plating
Semi-Bright Nickel plating
Stainless Passive Treatment
Tin-Nickel alloy plating
Zinc-Nickel alloy plating

Abrasion & Wear Resistant platings

Electroless Nickel Boron Tungsten Plating
Gold Iron alloy plating (Cobalt and Nickel free)
Hard Gold plating
Hard Silver plating
Indium plating
Palladium-Cobalt alloy plating
Palladium-Nickel alloy plating
Plating on Titanium
Pure Palladium plating
Rhodium plating
Silver-Tin alloy plating

Hard platings

Cobalt-Nickel alloy plating (metallization)
Electroless Nickel Boron Tungsten Plating
Electroless Nickel plating/metallization (containing Boron)
Nickel Iron alloy plating
Palladium-Cobalt alloy plating
Palladium-Nickel alloy plating
Plating on Powder Particles
Powder Cu copper plating (Metallization)
Powder Ni Nickel Plating (Metallization)
Pure Palladium plating
Rhodium plating

Good Bonding & Soldering platings

Bright Gold plating (metallization) (containing Cobalt)
Bright Nickel plating (metallization)
Bright Tin plating (metallization)
Direct Gold plating on SUS without Ni under plating
Direct Silver plating on SUS without Ni under plating
Direct Tin plating on SUS without Ni under plating
Discoloration resistant silver plating (MC-11NT-A, B, C)
Electroless Gold plating (immersing type for thin deposit)
Electroless Gold plating (reduction type for thick deposit)
Electroless Nickel plating (containing Phosphorus)
Electroless Nickel plating/metallization (containing Boron)
Gold Iron alloy plating (Cobalt and Nickel free)
Gold-Tin alloy plating
Heat resistant silver plating (MC-11HR-A, B)
High reflective Gold plating
High-technology Three Partial plating
Matte Gold plating
Matte Nickel plating
Matte Tin plating
Nickel plating for wire bonding
Porous Nickel plating
Pure Gold plating
Reel to Reel Tin-Copper alloy solder plating
Reel-to-Reel Gold and Tin plating
Reel-to-Reel Gold and Tin-Copper alloy plating
Reel-to-Reel Gold plating
Reel-to-Reel Silver plating
Semi-Bright Nickel plating
Super soldering Gold plating
Tin Reflow Plating
Tin-Antimony alloy plating
Tin-Nickel alloy plating

High Thermal Conductive platings

Alkaline Copper plating (metallization)

Max. size (DxWxH)
400mm x 500mm x 300mm

Bright Silver plating (metallization)
Copper sulfate plating (metallization)
Matte Silver plating

High Conductive platings

Alkaline Copper plating (metallization)

Max. size (DxWxH)
400mm x 500mm x 300mm

Bright Gold plating (metallization) (containing Cobalt)
Bright Silver plating (metallization)
Copper sulfate plating (metallization)
Electroless Gold plating (immersing type for thin deposit)
Electroless Gold plating (reduction type for thick deposit)
Electroless Silver plating
Gold-Tin alloy plating
Hard Gold plating
Hard Silver plating
High-technology Three Partial plating
Matte Silver plating
Plating on Powder Particles
Plating on Titanium
Reel-to-Reel Gold and Tin plating
Reel-to-Reel Gold and Tin-Copper alloy plating
Reel-to-Reel Gold plating
Reel-to-Reel Silver plating
Super soldering Gold plating

Sealing platings

Electro Nickel-Phosphorus plating
Electroless Nickel plating (containing Phosphorus)
Gold Iron alloy plating (Cobalt and Nickel free)
Indium plating
Low phosphorus electroless Nickel plating
Matte Gold plating
Porous Nickel plating
Pure Gold plating

Galling Resistance platings

Indium plating

Non-Magnetic platings

Copper Tin alloy plating (metallization)
Copper Tin Zinc alloy plating (metallization)
Palladium-Cobalt alloy plating
Palladium-Nickel alloy plating
Pure Palladium plating

Paramagnetic platings

Cobalt-Nickel alloy plating (metallization)
Nickel Iron alloy plating

Anti Nickel-Allergic platings

Copper Tin alloy plating (metallization)
Copper Tin Zinc alloy plating (metallization)
Direct Gold plating on SUS without Ni under plating
Direct Silver plating on SUS without Ni under plating
Direct Tin plating on SUS without Ni under plating
Gold Iron alloy plating (Cobalt and Nickel free)

High Reflective platings

High reflective Gold plating

Light Absorbing/Anti Reflective platings

Black Arrow (low reflection black treatment)
Black Electroless Nickel plating (metallization)
Black Nickel plating (metallization)
Blackening treatment for Copper substrate
Low reflection black treatment (MC-04MB)
Ultraviolet Absorbing Black plating

Wire Bondability platings

Low phosphorus electroless Nickel plating
Nickel plating for wire bonding

Porous for Good Adhesion Resin Painting platings

Good Sliding / Lubricity platings

Composite electroless Nickel-PTFE plating
Silver-Tin alloy plating

Good Release platings

Composite electroless Nickel-PTFE plating
Electroless Nickel Boron Tungsten Plating

High Frequency platings

Alkaline Copper plating (metallization)

Max. size (DxWxH)
400mm x 500mm x 300mm

Electromagnetic Shield platings

Copper sulfate plating (metallization)

Anti-whisker Generation platings

Tin Reflow Plating

Heat Resistant platings

Electroless Nickel Boron Tungsten Plating
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