Platings > by Functional Property > Electromagnetic Shielding

Electromagnetic Shielding Platings

Mitsuya has provided advanced engineering solution service for various industrial platings with the electromagnetic shielding property.

Available platings

Copper Sulfate Plating (metallization)

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by Metal

Gold Plating (Au)

Silver Plating (Ag)

Platinum Plating (Pt)

Palladium Plating (Pd)

Rhodium Plating (Rh)

Copper Plating (Cu)

Indium Plating (In)

Tin Plating (Sn)

Zinc Plating (Zn)

Nickel Plating (Ni)

Developed Technology

Other Finishings

Successful Prototype

by Functional Property

Abrasion & Wear Resistance

Anti-Whisker

Corrosion Resistance

Electromagnetic Shielding

Galling Resistance

Good Bondability

Good Releasability

Good Slidability

Hardness

Heat Resistance

Electrical Conductivity

High Frequency

High Reflectivity

High Thermal Conductivity

Light Absorbing

Low Contact Resistance

Nickel-free

Non-Magnetic

Paramagnetic

Porosity

Sealability

Wire Bondability

Water & Alkali Resistance

Tarnish Resistance

by Industry

Aerospace

Automotive

Automotive (Airbag)

Automotive (IGBT)

3D Printing

Busbar

Sensors

High precision connectors

Switches

Electronics

Communication

Medical

Semi-conductor (IC)

Optical Electronics

Smart grid

Machinery

Construction

Battery

by Process Type

Barrel

Rack

Mesh Basket

Reel to Reel

by Substrate

Copper

Brass

Phosphor Bronze

Beryllium Copper

Titanium Copper

Aluminum

Stainless Steel

Zinc

Magnesium

Titanium

Molybdenum

Tungsten

Nickel

Invar

Kovar

German (Nickel) Silver

Alloy 42

Hastelloy

Die Casting

Ceramics

Carbon

Powder

Silicon Wafer

Semiconductor Wafer

Glass

Plastics

Vapor/Sputtering deposition

Inquiry Form and Contact

We appreciate your interest in our platings and plating solutions.
Please fill in the following inquiry form about your requirements or give us a call at the number below.

Mail Form +81-3-6421-7197

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