Platings > by Metal > Gold platings

Gold platings

sample of Gold platings

Gold is soft, and easy to process. Moreover gold is chemically stable and keeps longer beautiful appearance because it is excellent in a corrosion resistance. Therefore, it has been used as ornaments and money from the old days.
In addition, it has high electrical conductivity and thermal conductivity. Gold is such a good metal, but famous for expensive because the amount of production is small.
However, our plating technology gives the material excellent properties described above by using a small quantity. By plating the gold on the material, you can get the following properties to the material. (Corrosion resistance, low contact resistance, high bonding properties, high electrical conductivity, sealability, high frequency characteristic, highly reflective, thermally conductive, etc.)
And the properties of the gold plating are used in the following products. (Connector, sensor electrode, semiconductor components, optical parts, medical parts, etc.)
Because the gold is expensive, plating costs will also be higher. However, we can control the plating thickness, and can plate partially. Thus we can contribute to the cost reduction.
We have offered a number of gold-plating which has new properties. (Hard gold plating, high purity gold, gold-plated to raise the reflectance, etc.) Mitsuya has prepared 25 kinds of gold-plating for utilizing the merits of the gold plating to the product. You can choose the optimal gold-plating that conform to the product's specifications. In addition, we can propose the optimal solution.
We will introduce the physical properties of gold or gold plating.

Properties of gold or gold plating

  • Density (g/cm3)  19.32
  • Melting Point (℃)  1,064
  • Thermal Conductivity (Wm-1K-1) 319
  • Electrical Resistivity (10-6Ωcm) 2.21
  • Hardness (Hv)  90-230

Available platings

Pick up properties

We will introduce the property data about the gold platings as follows.
These help you to find the property which you need.

Purity of gold plating

The purity of the gold plating can be obtained from 70 wt% to 99.9 wt% depending on the type of the plating solution. You can choose the pure gold or the alloy as considering the characteristics, such as hardness, optical reflectance, bonding and solder melting.

Hardness of gold plating

The plating for the connectors and the contacts and the probe-pins, are required wear resistance and hardness. The hard gold can be obtained by adding the cobalt or nickel in the gold. We can provide a gold plating having a knoop hardness 250.

Metal allergy-free gold plating

A hard gold usually contains the cobalt or the nickel as mentioned in above section. However, the cobalt and the nickel will be a cause of metal allergy. We can provide a hard gold plating, which does not contain the cobalt and the nickel. Addtionaly, we can supply a direct gold plating, which does not require the nickel plating as under plating on SUS.

Contact resistance of gold plating

We propose a gold plating with low contact resistance value.

Soldering of gold plating

We propose the type of gold-plating, which is suitable for the solderability.

Reflectance of gold plating

We can introduce a high reflective gold plating, which has the higher reflectance compared with the traditional bright gold plating. High reflective gold plating is applied to the reflective mirror and collector.

Partial gold plating

We can submit our proposal to realize the high efficiency and the cost reduction, by the partial portion plating.

Sealing treatment

As gold plating is getting thiner, pinholes will occurs. Thus the under layer or the substrate might have the corrosion. By performing a sealing treatment, the corrosion resistance is improved. You are able to choose the type of sealing treatment from a water-soluble, non-aqueous. and so on.

High-temperature solder

We can provide the gold-tin alloy plating as the high reliability at high temperatures and the lead-free material for step soldering. Our gold-tin alloy plating has advantages of the uniform composition and the uniform thickness. We can also show the melting characteristics of this alloy plating.

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