Platings > Gold-Tin Alloy Plating

Gold-Tin Alloy Plating

sample of Gold-Tin Alloy Plating

We offer a plating deposit as a lead-free solder for high-temperature connections, and as a solder for high-strength and high-reliability connections.
Both rack plating and barrel plating are available.
We can provide a thinner plating deposit than sheet material or ribbon material. And we can also form the deposit on the selected portion.
The eutectic and non-eutectic compositions of gold-tin alloys plating can be provided, too.
Our gold-tin alloy plating can be applied to the parts that require high-temperature connection or high-reliability connection.

movie of Gold-Tin Alloy Plating

This movie shows the result of Mitsuya gold-tin plating deposit by DTA. You can see the melting vividly and dramatically at the eutectic point. (47sec.)
(* Any software to play MP4 movie file is required.)

Functional property

  • Good Bondability
  • High Electrical
  • Low Contact Resistance

Industry employed

  • Sensors
  • Semi-conductor (IC)
  • Optical Electronics


Availability details

mass production yes
process type B,R
under plating Cu,Ni,Pd-N,Ni-P
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
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