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Analysis of plating deposit & substrate

Our analytical instruments for observing deposits and substrates are picked up as follows. Due to these instruments, we can provide an advanced solution on plating and finishing.

X-ray fluorescence spectrometer (XRF)

X-ray fluorescence spectrometer (XRF)

XRF is used for qualitative and quantitative analysis of the specimen surface, the thickness of plating deposits by radiating the surface and detecting generating X-ray fluorescence.
Furthermore, we can analyze the RoHS restricted substances such as Cd and Pb in extremely small amount.

Scanning Electron Microscope/Energy Dispersive X-ray Spectroscope (SEM/EDS)

SEM/EDS

We can observe the specimen surface at high magnification (100-50000 times) and can also analyze the elements by using the EDS attached to this equipment.

Laser microscope

Laser microscope

A feature of the laser microscope is that the surface shape of specimen could be measured at high precision and by non-contact method.

Digital microscope

Digital microscope

By the digital microscope, we can observe the surface of substrates or deposits accurately and quickly from low to high magnification(from 50 to 5000 times).

Cross-section Polisher

Cross-section Polisher

When we need to observe the cross-section at high accuracy, the specimen is made by this cross-section polisher. Because the specimen is cut by the ion beam, the deformation and slant edge do not be generated. 

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