Platings > by Functional Property > Wire Bondability
Wire Bondability platings
Wire bonding involves the electrical connection of wires to electrodes within devices like printed circuit boards, semiconductor packages, and integrated circuits. Common wire materials include aluminum, gold, and silver.
Compared to soldering, wire bonding is preferred for its heightened reliability, especially with delicate and compact components. Two primary techniques, thermo-compression bonding and high-frequency bonding, are utilized, with the latter gaining prominence.
Mitsuya offers diverse plating options for wire bonding, including nickel plating for aluminum, matte gold plating for gold, and matte silver plating for silver wire bonding applications.
Low phosphorus electroless Nickel plating
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