Platings > by Functional Property > Wire Bondability

Wire Bondability platings

Wire bonding is a method for electrically connecting the wires to the electrodes in a printed circuit board, a semiconductor package and an integrated circuit.
Metal wire material is aluminum, gold and silver.
Wire bonding is demanded high reliability compared to a soldering in case of the fine and small parts.
There is a thermo-compression bonding and high frequency bonding. High frequency junction has become the mainstream.
Mitsuya can provide plating for various wire bonding - nickel plating for aluminum wire bonding, matte gold plating for gold wire bonding, and matte silver plating for silver wire bonding.

Available platings

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