Solutions > Gold-Tin alloy plating (metallization)

Solution - Gold-Tin alloy plating (metallization)

With the increasing density and cost-efficiency demands of semiconductor elements, Company C required an additional process after gold plating on element terminals.

We proposed gold-tin plating as an alternative to gold plating. Our technical department developed the plating process and successfully achieved good adhesion and uniform thickness, enabling mass production.

Plating detail

Achievement

  • Quality improvement
  • Cost reduction
  • Providing a searched plating
  • Difficult material to be plated
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