Platings > Electroless Gold Plating (Immersion Type for Thin Deposit)

Electroless Gold Plating (Immersion Type for Thin Deposit)

sample of Electroless Gold Plating (Immersion Type for Thin Deposit)

This plating is used when we need to form a thin gold plating on the nickel surface. The plating thickness is less than 0.05μm. Because of the electroless plating type, this plating can be applied to deposits on independent circuit pattern.
Features of Mitsuya's electroless gold plating (thin) are as follows.
・Good solder wettability and good joint strength
・Low temperature forming (80 ℃)
・Less damage to the under layer nickel
・Fine and uniform deposit

Functional property

  • Low Contact Resistance
  • Good Bondability
  • Electrical Conductivity

Industry employed

  • Sensors
  • Semi-conductor (IC)

Solutions

Availability details

mass production no
process type ※ R,M
under plating Ni-p
prototype yes
experimental trial yes
regular chemical stock yes
※
B:barrelR:rackM:mesh basketH:reel to reel
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