Platings > Electroless Gold Plating (Reduction Type for Thick Deposit)

Electroless Gold Plating (Reduction Type for Thick Deposit)

sample of Electroless Gold Plating (Reduction Type for Thick Deposit)

This plating is used to plate circuit substrates that have independent patterns which need good solderability and low contact resistance. This can be used when we need a thick electroless gold plating.
Features of electroless gold thick plating of Mitsuya are follows.
・This electrolress gold plating has a stable deposition rate, you can choose the thickness of plating up to a few μm from 0.1μm.
・The plating process leaves little to no damage on the substrate and resist.
・It is suitable for plating fine patterns.
・It can reduce the occurrence of tarnish and uneven plating.
・Excellent wire bonding properties.

Functional property

  • Low Contact Resistance
  • Good Bondability
  • High Electrical

Industry employed

  • Sensors
  • Semi-conductor (IC)

Availability details

mass production no
process type R,M
under plating Au
prototype yes
experimental trial yes
regular chemical stock no
B:barrelR:rackM:mesh basketH:reel to reel
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