Platings > Direct Tin Plating on SUS Without Nickel under plating

Direct Tin Plating on SUS Without Nickel under plating

sample of Direct Tin Plating on SUS Without Nickel under plating

We can provide direct tin plating on SUS. You can avoid nickel allergy because there is no nickel as the under layer and you can also can get high corrosion resistance, high heat resistance and good productivity benefits.
It can keep an excellent solderability in reflow soldering at the selective tin plated area.

Functional property

  • Nickel-free
  • Good Bondability
  • Low Contact Resistance

Industry employed

  • Sensors

Availability details

mass production no
process type ※ R
under plating -
prototype no
experimental trial yes
regular chemical stock yes
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B:barrelR:rackM:mesh basketH:reel to reel
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