Platings > Electroless Silver Plating

Electroless Silver Plating

Electroless silver plating can be deposited on the electrically independent island portion like an insular circuit pattern.
It is used in the portion that requires properties like solderability, bondability and low contact resistivity.
The plating deposit thickness is up to about 0.3μm.

Functional property

  • Low Contact Resistance
  • Electrical Conductivity

Industry employed

  • Sensors

Availability details

mass production no
process type ※ R,M
under plating Ni-P
prototype yes
experimental trial yes
regular chemical stock no
※
B:barrelR:rackM:mesh basketH:reel to reel
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