Platings > Copper Tin Alloy Plating (metallization)

Copper Tin Alloy Plating (metallization)

Copper-tin alloy plating is an alternative deposit of nickel plating and can be applied as a new anode electrode material.
A copper-tin alloy with a high tin content is called "speculum alloy". We provide the alloy plating, which tin content is from 30 to 70 wt.%.
This alloy was initially attempted as a material for reflectors. However, there was a problem such as the reflectance decreases due to oxidation. On the other hand, speculum alloy has been noted again as a new material for alternative deposit of nickel, since nickel may cause metal allergies. It can also be used for an anode material of lithium battery.

Note: Presently, experimental trial at our technical center only.

Functional property

  • Nickel-free
  • Non-Magnetic

Industry employed

  • Electronics
  • Medical

Availability details

mass production no
process type ※
under plating -
prototype no
experimental trial yes
regular chemical stock no
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B:barrelR:rackM:mesh basketH:reel to reel
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