Platings > Pure Palladium Plating
Pure Palladium Plating
Pure palladium plating deposit is used for electronic parts such as the general switch component connector parts because it has non-magnetic, high electric conductivity and good solderability characteristics.
It is known that there is a large improvement in the heat resistance, the contact resistance and the solderability, when the palladium is plated on the nickel plated part with under 0.１micrometer thickness.
It is also used as an under layer of gold plating. The barrel, the hoop and the rack plating type are all available. The hardness is about Hv200.
Functional property
- Abrasion & Wear Resistance
- Corrosion Resistance
- Non-Magnetic
Industry employed
- Electronics
Availability details
| mass production | yes |
|---|---|
| process type ※ | B,R,M,H |
| under plating | Ni,st.Au |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
- ※
- B:barrelR:rackM:mesh basketH:reel to reel
Mail Form
+81-3-6421-7197
