Platings > Electroless Nickel Plating (containing Phosphorus)
Electroless Nickel Plating (containing Phosphorus)
Electroless nickel plating is a deposit by chemical reaction, not by electric power supply. Because a phosphoric acid compound is used as a reducing agent, this deposit is a nickel-phosphorus alloy.
This plating is applied to the surface finishing of the mechanical parts or the electronic devices, because of a good corrosion resistance and good abrasion resistance properties. It is also applied to parts that are not magnetic, because of its non-magnetic property.
This plating thickness has good uniformity. We are able to increase the hardness by heat treatment, however the deposit will become magnetized.
Functional property
- Low Contact Resistance
- Sealability
- Good Bondability
Industry employed
- Semi-conductor (IC)
Solutions
Availability details
| mass production | yes |
|---|---|
| process type ※ | B,R,M |
| under plating | Ni,Cu |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
- ※
- B:barrelR:rackM:mesh basketH:reel to reel
Mail Form
+81-3-6421-7197
