Platings > Electroless Nickel Plating (containing Phosphorus)

Electroless Nickel Plating (containing Phosphorus)

sample of Electroless Nickel Plating (containing Phosphorus)

Electroless nickel plating is a deposit by chemical reaction, not by electric power supply. Because a phosphoric acid compound is used as a reducing agent, this deposit is a nickel-phosphorus alloy.
This plating is applied to the surface finishing of the mechanical parts or the electronic devices, because of a good corrosion resistance and good abrasion resistance properties. It is also applied to parts that are not magnetic, because of its non-magnetic property.
This plating thickness has good uniformity. We are able to increase the hardness by heat treatment, however the deposit will become magnetized.

Functional property

  • Low Contact Resistance
  • Sealability
  • Good Bondability

Industry employed

  • Semi-conductor (IC)


Availability details

mass production yes
process type B,R,M
under plating Ni,Cu
prototype yes
experimental trial yes
regular chemical stock yes
B:barrelR:rackM:mesh basketH:reel to reel
page top