Solutions > Plating (metallization) onto wafer measurement equipment

Solution - Plating (metallization) onto wafer measurement equipment

Company O, involved in semiconductors, requested our company to apply uniform plating onto their wafer measurement equipment.

Their requirements included thick, uniform, and corrosion-resistant plating on an aluminum disk, with strict quality standards such as a 5μm tolerance on the plating thickness at 36 measurement points.

Our technical and manufacturing departments collaborated to improve the process, and we successfully achieved mass production with the required quality standards.

Plating detail

Achievement

  • Providing a searched plating
  • Difficult material to be plated
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