Solutions > Plating (metallization) onto wafer measurement equipment

Solution - Plating (metallization) onto wafer measurement equipment

AA Company which is related to semiconductor requested our company to apply the uniform plating onto the wafer measurement equipment.
Their request was a thick, good uniform and corrosion resistant plating on the aluminum disk.
Additionally, they required the strict quality such as 5μm tollerance on the plating thickness at 36 measurement points.
Our technical division and manufacturing division have improved the process and the plating for mass-production was realized with the required quality.

Plating detail


  • Providing a searched plating
  • Difficult material to be plated
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