Platings > Gold-Tin Alloy Plating
Gold-Tin Alloy Plating
We offer a plating deposit as a lead-free solder for high-temperature connections, and as a solder for high-strength and high-reliability connections.
Both rack plating and barrel plating are available.
We can provide a thinner plating deposit than sheet material or ribbon material. And we can also form the deposit on the selected portion.
The eutectic and non-eutectic compositions of gold-tin alloys plating can be provided, too.
Our gold-tin alloy plating can be applied to the parts that require high-temperature connection or high-reliability connection.
This movie shows the result of Mitsuya gold-tin plating deposit by DTA. You can see the melting vividly and dramatically at the eutectic point. (47sec.)
(* Any software to play MP4 movie file is required.)
Functional property
- Good Bondability
- Electrical Conductivity
- Low Contact Resistance
Industry employed
- Sensors
- Semi-conductor (IC)
- Optical Electronics
Solutions
Availability details
| mass production | yes |
|---|---|
| process type ※ | B,R |
| under plating | Cu,Ni,Pd-Ni,Ni-P |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
- ※
- B:barrelR:rackM:mesh basketH:reel to reel
Mail Form
+81-3-6421-7197
