Solutions > Nickel plating (metallization) for wire bonding
Solution - Nickel plating (metallization) for wire bonding
In company A, the metal substrate mounted sensor chips was connected to the base-plate (frame) by aluminum wire bonding. However, the bonding strength was weak, so the yield was low.
We recommended adopting our established nickel plating for wire bonding. We and company A produced the sample experimentally and evaluated it. As a result, the yield of the device improved nearly 100%. In addition, our plating is proceed by the reel-to-reel type, we have achieved the overall cost reduction.
Achievement
- Quality improvement
- Cost reduction