Solutions > Nickel plating (metallization) for wire bonding

Solution - Nickel plating (metallization) for wire bonding

At Company A, sensor chips mounted on a metal substrate were connected to the base plate (frame) using aluminum wire bonding. However, due to weak bonding strength, the yield was low.

We recommended adopting our proven nickel plating process for wire bonding. Together with Company A, we experimentally produced and evaluated samples. As a result, the device yield improved to nearly 100%.

Additionally, since our plating process is conducted using a reel-to-reel system, we successfully achieved overall cost reduction.

Achievement

  • Quality improvement
  • Cost reduction
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