Platings > Gold-Tin (AuSn) alloy plating (MC-12GT)
Gold-Tin (AuSn) alloy plating (MC-12GT)
Gold-tin alloy plating has a eutectic point with a composition of 80 gold: 20 tin and a melting point of 280°C.
In many cases, gold-tin alloys are metallurgically produced, but this is becoming more difficult as the miniaturization of parts advances.
The gold-tin alloy plating developed by Mitsuya enables the plating of fine parts and the control of the plating film with a uniform eutectic composition.
Therefore, it can be expected to be used as a high-temperature lead-free solder material.
・Thin film formation: The Au-Sn film thickness can be controlled, making it possible to make thin films (with a track record of 33% cost reduction).
・Wide alloy composition: The alloy ratio can be changed arbitrarily, and a wide range of film compositions (Au90-70wt% proven) can be obtained.
・Highly reliable bonding: Oxidation resistance and good solderability enable highly reliable bonding.
When considering solder joint applications, if you are using an Au film for the seed layer, please let us know the details of the specifications in advance.
Availability details
| mass production | yes |
|---|---|
| process type ※ | B,R |
| under plating | Cu, Ni, Pd-Ni, Ni-P |
| prototype | yes |
| experimental trial | yes |
| regular chemical stock | yes |
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- B:barrelR:rackM:mesh basketH:reel to reel
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