Platings > by Functional Property > Wire Bondability

Wire Bondability platings

Wire bonding is a method for electrically connecting the wires to the electrodes in a printed circuit board, a semiconductor package and an integrated circuit. Metal wire material is aluminum, gold and silver. Wire bonding is demanded high reliability compared to a soldering in case of the fine and small parts. There is a thermo-compression bonding and high frequency bonding. High frequency junction has become the mainstream. Mitsuya can provide the plating for each wire, like a nickel plating onto aluminum wire, matte plating onto gold wire and matte silver plating onto silver wire.

Available platings

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