Platings > Electroless Nickel plating/metallization (containing Boron)

Electroless Nickel plating/metallization (containing Boron)

Electroless nickel-boron plating is used for the under layer for ceramic substrate circuits and the parts that require soldering.
The purity of nickel for electroless nickel-boron can be higher than the electroless nickel-phosphorus deposit.
Precious metals such as gold is plated on the electroless nickel-boron plating, whenever required. Electroless nickel-boron which has low content boron (high-purity nickel) shows magnetic (ferromagnetic) property.
This plating is employed on analytical instruments.

Functional property

  • Good Bonding & Soldering
  • Hard
  • Corrosion Resistant

Industry employed

  • Semi-conductor (IC)

Availability details

mass production no
process type ※ R,M
under plating -
prototype yes
experimental trial yes
regular chemical stock yes
※
B:barrelR:rackM:mesh basketH:reel to reel
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