Electroless Nickel plating (containing Phosphorus)

Electroless Nickel plating (containing Phosphorus)

Electroless nickel plating is a deposit by the chemical reaction, not by the electric power supply. Because the phosphoric acid compound is used as a reducing agent, this deposit is nickel-phosphorus alloy.
This plating is applied to the surface finishing of the mechanical parts or the electronic devices, because of a good corrosion resistance and good abrasion resistance. It is also applied to the parts, which avoid a magnetic, because of non-magnetic property.
This plating thickness is a good uniformity. It is able to increase the hardness by heat treatment, however the deposit is magnetized.

Functional property

  • Low Contact Resistance
  • Sealing
  • Good Bonding & Soldering

Industry employed

  • Semi-conductor
  • Analytical instruments

Availability details

factory Tokyo
mass production yes yes yes yes
process type R,M B,R,M B,R,M B,R,M
under plating Ni,Cu Ni,Cu Ni,Cu Ni,Cu
prototype yes yes yes yes
experimental trial yes yes yes yes
chemical stock
yes yes yes yes

process type: B(barrel) R(rack) M(mesh basket) H(reel to reel)

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